Epoxy Resin Curing Agent (Dycure Series)
【PRODUCT NAME】:Epoxy resin curing agent (Dycure Series)
【MOLECULAR FORMULA】:C2H4N4
【MOLECULAR WEIGHT】:84.08
【CAS No.】:461-58-5
【PACKING】:15kg/cartons
【PRODUCT DESCRIPTION:】:Dycure 10 is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clomping and improve application.It is designed for use as a latent curing agent for epoxy resins.
【PRODUCT USAGE】 Dycure used at thermosetting epoxy resin system as latent curing agent, which is less than 1.6%of dispersant, in order to prevent the product caking and promote Dycure evenly dispersed in the epoxy resin system, widely used in one-component adhesive glue agent,composite materials and powder coating. Also supply customized supply customized 10um, 8um, 6um, 4pm, etc.
【ADVANTAGE】:
1. Fine particle size provides enhanced reactivity versus coarser grades.
2. Easily dispersed in liquid resins.
3. Shelf stability up to 6 months at 25°C in properly formulated systems.
4. Activation temperature can be easily varied from 180° C to 100° C with appropriate accelerator selection.
【APPLICATION】:
1. One component adhesives
2. Epoxy powder coatings
3. Prepregs and film adhesives
4. Electronic potting and encapsulating compounds
【SPECIFICATION】
Appearance | Free Flowing White Powder |
Purity(HPLC) | ≥97.3% |
Free Water | ≤0.3 |
Melt Point | 209-212(°C) |
Dispersant | ≤1.6% |
Particle Size (D90) | ≤10μm |
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