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Epoxy Resin Curing Agent (Dycure Series)

【PRODUCT NAME】:Epoxy resin curing agent (Dycure Series)

【MOLECULAR FORMULA】:C2H4N4

【MOLECULAR WEIGHT】:84.08 

【CAS No.】:461-58-5

【PACKING】:15kg/cartons

【PRODUCT DESCRIPTION:】:Dycure 10 is an ultra-micronized grade of dicyandiamide containing 1.5% of anti-blocking agent to prevent clomping and improve application.It is designed for use as a latent curing agent for epoxy resins.

【PRODUCT USAGE】 Dycure used at thermosetting epoxy resin system as latent curing agent, which is less than 1.6%of dispersant, in order to prevent the product caking and promote Dycure evenly dispersed in the epoxy resin system, widely used in one-component adhesive glue agent,composite materials and powder coating. Also supply customized supply customized 10um, 8um, 6um, 4pm, etc.

【ADVANTAGE】: 

1. Fine particle size provides enhanced reactivity versus coarser grades.

2. Easily dispersed in liquid resins.

3. Shelf stability up to 6 months at 25°C in properly formulated systems.

4. Activation temperature can be easily varied from 180° C to 100° C with appropriate accelerator selection.

【APPLICATION】:

1. One component adhesives

2. Epoxy powder coatings

3. Prepregs and film adhesives

4. Electronic potting and encapsulating compounds

【SPECIFICATION】

Appearance

Free Flowing White Powder

Purity(HPLC)

 ≥97.3%

Free Water

≤0.3

Melt Point

209-212(°C)

Dispersant

≤1.6%

Particle Size (D90)

≤10μm

 

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